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NSB12ANT3G 600 Watt Peak Power Zener Transient Voltage Suppressor
Unidirectional
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The NSB12ANT3G is designed to protect voltage sensitive components from high voltage, high energy transients. This device has excellent clamping capability, high surge capability, low zener impedance and fast response time. The NSB12ANT3G is ideally suited for use in computer hard disk drives, communication systems, automotive, numerical controls, process controls, medical equipment, business machines, power supplies, and many other industrial/ consumer applications.
Specification Features:
PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSOR 600 WATT PEAK POWER
* Working Peak Reverse Voltage Range - 12 V * Peak Power - 600 Watts @ 1 ms at Maximum Clamp Voltage @ * * * * * *
Peak Pulse Current ESD Rating of Class 3 (> 16 kV) per Human Body Model ESD Rating IEC 61000-4-2 Level 4 (> 30 kV) Low Leakage < 5 mA at 12 V UL 497B for Isolated Loop Circuit Protection Response Time is Typically < 1 ns Pb-Free Package is Available
Cathode
Anode
SMB CASE 403A PLASTIC
Mechanical Characteristics: CASE: Voidfree, transfermolded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are
MARKING DIAGRAM
readily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds
LEADS: Modified L-Bend providing more contact area to bond pads POLARITY: Cathode indicated by polarity band MOUNTING POSITION: Any MAXIMUM RATINGS
Please See the Table on the Following Page A Y WW LEK G
AYWW LEK G G
= Assembly Location = Year = Work Week = Specific Device Code = Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device NSB12ANT3G Package SMB (Pb-Free) Shipping 2500/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2007
1
December, 2007 - Rev. 0
Publication Order Number: NSB12AN/D
NSB12ANT3G
MAXIMUM RATINGS
Rating Peak Power Dissipation (Note 1) @ TL = 25C, Pulse Width = 1 ms DC Power Dissipation @ TL = 75C Measured Zero Lead Length (Note 2) Derate Above 75C Thermal Resistance from Junction to Lead DC Power Dissipation (Note 3) @ TA = 25C Derate Above 25C Thermal Resistance from Junction to Ambient Operating and Storage Temperature Range Symbol PPK PD RqJL PD RqJA TJ, Tstg Value 600 3.0 40 25 0.55 4.4 226 -65 to +150 Unit W W mW/C C/W W mW/C C/W C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 10 X 1000 ms, non-repetitive at maximum IPPM and VCM, see electrical characteristics. 2. 1 square copper pad, FR-4 board 3. FR-4 board, using ON Semiconductor minimum recommended footprint, as shown in 403A case outline dimensions spec.
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT IF VF Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF VC VBR VRWM IF
I
IR VF IT
V
IPP
Uni-Directional TVS
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Parameter Zener Voltage (Note 5) Reverse Leakage Current Clamping Voltage Forward Peak Voltage Conditions IT = 1 mA VRWM = 12 V IPPM = 30.2 A (Per Figure 1, Note 6) IF = 30 A (Note 4) Symbol VBR IR VCM VF Min 13.2 Typ 13.75 Max 14.3 5.0 19.9 3.5 Unit V mA V V
4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, non-repetitive duty cycle. 5. VZ measured at pulse test IT at an ambient temperature of 25C. 6. Absolute Maximum Peak Current, IPPM.
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NSB12ANT3G
PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ T = 25 C A PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IPP. 160 140 120 100 80 60 40 20 0 0 25 50 75 100 125 150
tr 10 ms 100 VALUE (%) PEAK VALUE - IPP
HALF VALUE 50 tP 0
IPP 2
0
1
2 t, TIME (ms)
3
4
TA, AMBIENT TEMPERATURE (C)
Figure 1. 10 x 1000 ms Pulse Waveform
Figure 2. Pulse Derating Curve
TYPICAL PROTECTION CIRCUIT
Zin
Vin
LOAD
VL
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NSB12ANT3G
APPLICATION NOTES
RESPONSE TIME
In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 3. The inductive effects in the device are due to actual turnon time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 4. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. The SMB series have
a very good response time, typically < 1 ns and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, minimum lead lengths and placing the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Zin is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation.
DUTY CYCLE DERATING
If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 5. Average power must be derated as the lead or ambient temperature rises above 25C. The average power derating curve normally given on data sheets may be normalized and used for this purpose.
V
Vin (TRANSIENT)
V
OVERSHOOT DUE TO INDUCTIVE EFFECTS
Vin (TRANSIENT) VL
VL
Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECT t
t
Figure 3.
Figure 4.
1 0.7 0.5 DERATING FACTOR 0.3 0.2 0.1 0.07 0.05 0.03 0.02 10 ms 0.01 0.1 0.2 0.5 1 2 5 10 D, DUTY CYCLE (%) 20 50 100 100 ms PULSE WIDTH 10 ms
1 ms
Figure 5. Typical Derating Factor for Duty Cycle
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NSB12ANT3G
UL RECOGNITION The entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGV2) under the UL standard for safety 497B and File #116110. Many competitors only have one or two devices recognized or have recognition in a nonprotective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several tests including Strike Voltage Breakdown test, Endurance Conditioning, Temperature test, Dielectric VoltageWithstand test, Discharge test and several more. Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category.
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NSB12ANT3G
PACKAGE DIMENSIONS
SMB CASE 403A-03 ISSUE F
HE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF
b
D
DIM A A1 b c D E HE L L1
MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76
MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030
MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261 0.089
2.743 0.108
2.159 0.085
SCALE 8:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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NSB12AN/D

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